




GOSON has over 5000 ㎡ of PCB manufacturing space and the world's most advanced production equipment ,which support the PCB surface processes: HASL-LFENlG, GOLD PLATED, TIN PLATED, SILVER PLATED, ENIPIG, OSP.
> 20+ Years industry experience
> 100+ Company employees
> 40% + Faster Design Cycles
> 1 Pieces + Lowest order quantity
> 190+ Customized solutions for clients

|
PCBA Specifications |
Process Capability |
| PCB Size | L50mm*w50mm~L510mm*w460mm |
| PCB Thickness | 0.2mm~6.0mm |
| PCB Material | Flexible & Hardboard |
| Component Size |
01005(Inch)~45mm*98mm |
| Component Pitch | 0.25mm(IC Lowest pitch) |
| 0.25mm(BGA Lowest pitch) |
|
|
Component Height |
Maximum 19mm |
|
Patch Precision |
chip class+41um,lC class+37.5um |
|
PCB Surface Treatment |
SMOBC/HASL |
|
Electrolytic gold |
|
|
Chemical gold |
|
|
Chemical silver |
|
|
Immersion gold |
|
|
Immersion tin |
|
|
OSP |
|
Service |
Times |
| Individual Assemblies | 1-5 Working Days |
| Turnkey Assemblies |
1-5 Working Days |
|
Service |
Times |
| ONE-STOP BOM Quote Service | 0-2 Working Days |
| Component Soucing Time |
2-5 Working Days(Based on the actual product) |
